Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...

LG Innotek announced on the 10th that it has successfully developed a ‘next-generation smart IC (integrated circuit) substrate’ that enhances performance while reducing carbon emissions by half ...

PSD@5KM+ expands ecosystem with co-working and talent development; 2nd batch of tech collaborators onboarded to expand IC design capabilities; Penang has reached a significant mil ...

Tesla and Samsung have struck a US$16.5 billion chip deal seen as a win-win, with Samsung's Texas fab set to produce Tesla's next-gen AI6 chips. Tesla gains customized supply chain support, while ...

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A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved ...