Fan-out wafer-level packaging (FOWLP) is a key enabler in the industry shift from transistor scaling to system scaling and integration. The design fans out the chip interconnects through a ...

This simple lower-body exercise strengthens hamstrings, hips, and lower back while dramatically improving balance and stability.

The downsizing trend of devices gives rise to continuous demands of increasing input/output (I/O) and circuit density, and these needs encourage the development of a High-Density Fan-Out (HDFO) ...

Engineers use a redistribution layer (RDL) in flip-chip designs to redistribute I/O pads to bump pads without changing the I/O pad placement. However, traditional routing capacity may be insufficient ...

SK keyfoundry, an 8-inch pure-play foundry in Korea, has successfully co-developed core technology and completed reliability testing of Direct RDL (Redistribution Layer) – a core semiconductor ...

With the rise of smart devices, applications for semiconductor components are quickly expanding. The requirements for chip size, information transmission speed, and power in network communications, ...