Abstract: We demonstrate a normally-off n-GaN/p-GaN/Al-GaN/GaN HEMT featuring a semiconducting gate (SG), i.e., an n-GaN layer overlaying the 2DEG channel as an ...
Abstract: We discuss recent advancements in the development of vertical GaN devices, and the related reliability challenges. Key results indicate that: (i) vertical GaN devices can show high ...
Abstract: We demonstrate for the first time a GaN chiplet technology based on 300mm GaN-on-silicon process. This GaN chiplet technology features: (a) industry’s thinnest GaN chiplet with an underlying ...